CVE-2021-1905

KEVQualcomm Multiple Chipsets Use-After-Free Vulnerability

Description

Multiple Qualcomm Chipsets contain a use after free vulnerability due to improper handling of memory mapping of multiple processes simultaneously.

Possible use after free due to improper handling of memory mapping of multiple processes simultaneously. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

CVSS 3.1 vectorCVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

PublishedMay 7, 2021

Last modifiedJun 17, 2026

Added to KEVNov 3, 2021

Remediation dueMay 3, 2022

References

qualcomm.com/company/product-security/bulletins/may-2021-bulletinPatchVendor Advisory
cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-2021-1905US Government Resource

0 recent articles mention this CVE

Risk assessment · High

Actively exploited. Patch immediately.

Exploitation: Confirmed in the wild (CISA KEV)
Federal remediation deadline: Overdue by 1638 days
CVSS: 8.4 HIGH
EPSS (30-day exploit probability): 1.5% · top 25% of all CVEs
Weakness: CWE-416
Preconditions: No privileges and no user interaction

Recommended actions

1.Apply updates per vendor instructions.
2.Treat as emergency change: patch or isolate internet-facing instances first.
3.Hunt for compromise: review logs for the disclosure window, not just from the patch date.

Assessment is derived automatically from the live signals above; verify against your own asset inventory.