CVE-2022-22071

KEVQualcomm Multiple Chipsets Use-After-Free Vulnerability

Description

Multiple Qualcomm chipsets contain a use-after-free vulnerability when process shell memory is freed using IOCTL munmap call and process initialization is in progress.

Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music

CVSS 3.1 vectorCVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

PublishedJun 14, 2022

Last modifiedJun 17, 2026

Added to KEVDec 5, 2023

Remediation dueDec 26, 2023

References

qualcomm.com/company/product-security/bulletins/may-2022-bulletinPatchVendor Advisory
cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-2022-22071US Government Resource

0 recent articles mention this CVE

Risk assessment · High

Actively exploited. Patch immediately.

Exploitation: Confirmed in the wild (CISA KEV)
Federal remediation deadline: Overdue by 1035 days
CVSS: 8.4 HIGH
EPSS (30-day exploit probability): 0.41% · top 65% of all CVEs
Weakness: CWE-416
Preconditions: No privileges and no user interaction

Recommended actions

1.Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
2.Treat as emergency change: patch or isolate internet-facing instances first.
3.Hunt for compromise: review logs for the disclosure window, not just from the patch date.

Assessment is derived automatically from the live signals above; verify against your own asset inventory.