CVE-2023-33063
KEVQualcomm Multiple Chipsets Use-After-Free Vulnerability
Description
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
Memory corruption in DSP Services during a remote call from HLOS to DSP.
CVSS 3.1 vector
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:HPublishedDec 5, 2023
Last modifiedJun 17, 2026
Added to KEVDec 5, 2023
Remediation dueDec 26, 2023
References
- qualcomm.com/company/product-security/bulletins/december-2023-bulletinPatchVendor Advisory
- cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-2023-33063US Government Resource
0 recent articles mention this CVE
69
Risk assessment · High
Actively exploited. Patch immediately.
- Exploitation
- Confirmed in the wild (CISA KEV)
- Federal remediation deadline
- Overdue by 1035 days
- CVSS
- 7.8 HIGH
- EPSS (30-day exploit probability)
- 0.67% · top 48% of all CVEs
- Weakness
- CWE-416
Recommended actions
- 1.Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
- 2.Treat as emergency change: patch or isolate internet-facing instances first.
- 3.Hunt for compromise: review logs for the disclosure window, not just from the patch date.
Assessment is derived automatically from the live signals above; verify against your own asset inventory.